2017 International Conference on Design Engineering and Product Innovation (ICDEPI 2017)

Country: Singapore

City: Nanyang Technological University

Abstr. due: 20.03.2017

Dates: 12.07.17 — 14.07.17

Area Of Sciences: Computer science;

Address: icdepi@smehk.org

Organizing comittee e-mail: icdepi@smehk.org

Organizers: HKSME


1. Conference Chairman 
* Prof. Cees de Bont, Hong Kong Polytechnic University, Hong Kong 
* Prof. Lucienne Blessing, Singapore University of Technology and Design, Singapore 
2.International Technical Committee 
*Prof. David Dornfeld, Lab for Manufacturing and Sustainability (LMAS), USA 
*Prof. Dantan Jean-yves, Universités chez ENSAM, France 
*Prof. Stefan Dimov, University of Birmingham, UK 
More is to be added…… 

●Topics of interest for submission include, but are not limited to: 
Design Processes 
Design Theory and Research Methodology 
Design Organization and Management 
Product, Service and Systems Design 
Design Information and Knowledge 
Human Behavior in Design 
Design Education 
Design Methods and Tools 
Machinery and Machine Design 
Product Development and Design 
Product Process Design and Management 
Product Quality Management 
Intelligent Product 
Product Exploitation Origination Innovation 
Product Structure Innovation 
●Paper Submission 
1, Papers can be submitted as PDF via EasyChair: 
2, You can also choose to submit your paper directly to icdepi@smehk.org 
3, Contributions must be written in English and report on original, unpublished work not submitted for publication elsewhere. Submissions not adhering to the above specified constraints may be rejected without review. 

Conference Web-Site: http://www.icdepi.org