7th Electronics System-Integration Technology Conference
Country: Germany
City: Dresden
Abstr. due: 15.02.2018
Dates: 18.09.18 — 20.09.18
Area Of Sciences: Technical sciences;
Organizing comittee e-mail: karlheinz.bock@tu - dresden.de
Organizers: IEEE
It is our pleasure to announce the 7 th ESTC Conference , the premier European scientific conference event in the field of microelectronics packaging and system integration . The conference will be held from 1 8 th to 20 th of September, 201 8 , at the W estin Bellevue Hotel in Dresden , Germany . This international event brings together both academics as well as the industry leaders to present and discuss state - of - the - art and the future trends in packaging and integration technologies. ESTC provides a perfect opportunity to learn about the latest developments in th ose field s . S ave the date right now! This major event only takes place once every 2 years. ESTC is supported by IEEE - EPS in association with IMAPS - Europe. Read more at www.estc - conference.net . ESTC 201 8 seeks original papers describing research and innovations in all areas of electronic packaging and system integration.
Conference Web-Site: https://www.estc-conference.net/estc-2018/calls/
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