7th Electronics System-Integration Technology Conference

Organizing comittee e-mail: karlheinz.bock@tu - dresden.de

Organizers: IEEE

It is our pleasure to announce the  7 th ESTC Conference , the premier European  scientific conference  event in the field of microelectronics packaging and  system  integration . The conference  will be held  from  1 8 th to 20 th of September, 201 8 , at  the W estin Bellevue Hotel  in Dresden ,  Germany . This international event brings together both academics as well as the  industry leaders to  present and  discuss state - of - the - art and the future trends in packaging and integration technologies.  ESTC provides a perfect opportunity to  learn about the latest developments in th ose field s . S ave the date right now! This major event only takes place once every 2 years. ESTC is  supported by IEEE - EPS in association with IMAPS - Europe. Read  more  at  www.estc - conference.net . ESTC 201 8 seeks original  papers  describing research  and  innovations  in  all  areas  of  electronic packaging and system integration.

Conference Web-Site: https://www.estc-conference.net/estc-2018/calls/