2019 International Conference on Computer-Aided Design

Organizing comittee e-mail: drechsler@uni-bremen.de

Organizers: IEEE/ACM

Original technical submissions on, but not limited to, the following topics are invited:
1) SYSTEM-LEVEL CAD
1.1 System Design

    System-level specification, modeling, and simulation
    System design flows and methods
    HW/SW co-design, co-simulation, co-optimization, and co-exploration
    HW/SW platforms for rapid prototyping
    System design case studies and applications
    System-level issues for 3D integration
    Micro-architectural transformation
    Memory architecture and system synthesis
    System communication architecture
    Network-on-chip design methodologies and CAD
    Modeling and simulation of heterogeneous platforms
    High-level synthesis for heterogeneous computing
    Power/performance analysis of heterogeneous and cloud platforms
    Programming environment of heterogeneous computing
    Application driven heterogeneous platforms for big data, machine learning etc.
    Applications and designs for systems based on optical devices

1.2 Embedded Systems and Cyberphysical Systems

    Multi-core/multi-processors systems
    HW/SW co-design for embedded systems
    Static and dynamic reconfigurable architectures
    Memory hierarchies and management
    System-level consideration of custom memory/storage architectures
    Application-specific instruction-set processors (ASIPs)
    CAD for Internet-of-Things (IoT) and sensor networks
    Design issues for Internet-of-Things (IoT) Devices
    Modeling and analysis of CPS
    CAD for automotive systems and power electronics
    Dependable and safe CPS design
    Analysis and optimization of data centers
    CAD for display electronics
    Green computing (smart grid, energy, solar panels, etc.)

1.3 Neural Network and Neuromorphic Computing

    Hardware and devices for neuromorphic and neural network computing
    Design method for learning on a chip
    Systems for neural computing (including deep neural networks)
    Neural network acceleration techniques including GPGPU, FPGA and dedicated
    ASICs
    CAD for bio-inspired and neuromorphic systems

1.4 Embedded Systems Software and Software Security

    Real-time software and operating systems
    Middleware and virtual machines, runtime support and resource management
    Timing analysis and WCET
    Profiling and compilation techniques, domain-specific embedded libraries
    Design exploration, synthesis, validation, verification, and optimization
    Software techniques and programming models for multicores, GPUs, and multithreaded embedded architectures
    System and embedded software security techniques
    Malware and Cloud security
    Security and privacy for the Internet of Things
    Embedded software forensics

1.5 Hardware Security

    Hardware-based security (CAD for PUF’s, RNG, AES etc)
    Detection and prevention of hardware Trojans
    Side-channel attacks, fault attacks and countermeasures
    Split Manufacturing for security
    Design and CAD for security
    Security implications of CAD
    Cyberphysical system security
    Nanoelectronic security
    Supply chain security and anti-counterfeiting

1.6 Low Power and Approximate Computing in System Design

    Power and thermal estimation, analysis, optimization, and management techniques for hardware and software systems
    Energy- and thermal aware application mapping and scheduling
    Energy- and thermal-aware dark silicon system design and optimization
    Energy- and thermal-aware architectures, algorithms and techniques
    Run-time management for the dark silicon
    New hardware techniques for approximate/stochastic computing

 
2) SYNTHESIS, VERIFICATION, & PHYSICAL DESIGN
2.1 High-Level, Behavioral, and Logic Synthesis and Optimization

    High-level/Behavioral/Logic synthesis
    Technology-independent optimization and technology mapping
    Functional and logic timing ECO
    Resource scheduling, allocation, and synthesis
    Interaction between logic synthesis and physical design

2.2 Testing, Validation, Simulation, and Verification

    High-level/Behavioral/Logic modeling and validation
    High-level/Behavioral/Logic simulation
    Formal, semi-formal, and assertion-based verification
    Equivalence and property checking
    Emulation and hardware simulation/acceleration
    Post-silicon functional validation
    Digital fault modeling and simulation
    Delay, current-based, low-power test
    ATPG, BIST, DFT, and compression
    Memory test and repair
    Core, board, system, and 3D IC test
    Post-silicon validation and debug
    Analog, mixed-signal, and RF test

2.3 Cell-Library Design, Partitioning, Floorplanning, Placement

    Cell-library design and optimization
    Transistor and gate sizing
    High-level physical design and synthesis
    Estimation and hierarchy management
    2D and 3D partitioning, floorplanning, and placement
    Post-placement optimization
    Buffer insertion and interconnect planning

2.4 Clock Network Synthesis, Routing, and Post-Layout Optimization and Verification

    2D and 3D clock network synthesis
    2D and 3D global and detailed routing
    Package-/Board-level routing and chip-package-board co-design
    Post-layout/-silicon optimization
    Layout and routing issues for optical interconnects

 
3) SOC ANALYSIS, DESIGN, SIMULATION, & TESTING
3.1 Design for Manufacturability and Design for Reliability

    Process technology characterization, extraction, and modeling
    CAD for design/manufacturing interfaces
    CAD for reticle enhancement and lithography-related design
    Variability analysis and statistical design and optimization
    Yield estimation and design for yield
    Physical verification and design rule checking
    DFM for emerging devices (3D, nanophotonics, non-volatile logic/memory, etc.)
    Machine learning for smart manufacturing and process control
    Analysis and optimization for device-level reliability issues (stress, aging effects,
    ESD, etc.)
    Analysis optimization for interconnect reliability issues (electromigration, thermal,
    etc.)
    Reliability issues related to soft errors
    Design for resilience and robustness
    Reliability issues for emerging devices (3D, optical, non-volatile, etc.)

3.2 Timing, Power and Signal Integrity Analysis and Optimization

    Deterministic and statistical static timing analysis and optimization
    Power and leakage analysis and optimization
    Circuit and interconnect-level low power design issues
    Power/ground network analysis and synthesis
    Signal integrity analysis and optimization

3.3 CAD for Analog/Mixed-Signal/RF and Multi-Domain Modeling

    CAD for analog, mixed-signal, RF
    CAD for mixed-domain (semiconductor, nanoelectronic, MEMS, and electrooptical) devices, circuits, and systems
    CAD for nanophotonics and optical devices
    Analog, mixed-signal, and RF noise modeling and simulation
    Device, interconnect and circuit extraction and simulation
    Package modeling and analysis
    EM simulation and optimization
    Behavior modeling of devices and interconnect
    Modeling of complex dynamical systems (molecular dynamics, fluid dynamics, computational finance, etc.)

 
4) CAD FOR EMERGING TECHNOLOGIES, PARADIGMS, & APPLICATIONS
4.1 Biological Systems and Electronics, Brain Inspired Computing, and New Computing Paradigms

    CAD for biological computing systems
    CAD for systems and synthetic biology
    CAD for bio-electronic devices, bio-sensors, MEMS, and systems

4.2 Nanoscale and Post-CMOS Systems

    New device structures and process technologies
    New memory technologies (flash, phase change memory, STT-RAM, memristor, etc.)
    Nanotechnologies, nanowires, nanotubes, graphene, etc.
    Quantum computing
    Optical devices, computing, and communication

Conference Web-Site: https://iccad.com/