ITherm 2020 - The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
City: Lake Buena Vista
Abstr. due: 02.09.2019
Dates: 26.05.20 — 29.05.20
Area Of Sciences: Physics and math;
Organizing comittee e-mail: email@example.com
Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2020 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
All papers will be peer reviewed and published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking Session.
Conference Web-Site: https://www.ieee-itherm.net/itherm/conference/home
Similar conferences with close deadlines:
2019 International Conference on Functional Materials and Applied Technologies (FMAT 2019)Theses applying till 20.09.19, Nanjing
2019 2nd International Conference on Electronics and Communication Engineering (ICECE 2019)Theses applying till 20.09.19, Xi'an
2nd Global Summit on PhysicsTheses applying till 25.09.19, paris