Surface Mount Technology Association International 2020

Country: USA

City: Rosemont

Abstr. due: 28.02.2020

Dates: 27.09.20 — 01.10.20

Area Of Sciences: Technical sciences;

Organizing comittee e-mail:

Organizers: Surface Mount Technology Association


Materials must be original, unpublished and non-commercial in nature. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data.

Advanced Packaging/Components:
2.5/3D Packaging and Integration BGA/CSP Biomedical Packaging Component Storage Connector Technology Copper Pillars Copper Wire Bonding Diffusion Bonding Embedded and Miniature Passives Environmental Testing Failure Analysis Techniques Flip Chip High Temperature Packaging Lead Finishes Magnetic Soldering MEMS and Sensors Moisture Sensitive Devices (MSD) Package on Package (PoP) Photonics Photovoltaics and Solar Reliability Silver Wire-bonding Stacked Die System in Package (SiP) Through Silicon Vias (TSVs) Tin Whiskers Wafer Level Packaging (WLP)

01005/03015 Components/Assembly 3D Board Assembly Additive Manufacturing SMT Adhesives Alternate Solder Alloys BGA/CSP Assembly Bottom Terminated Components Cavity Board Assembly Cleaning, Conformal Coating and Potting Connector Assembly to PCB DFX/Design for Six Sigma Direct Chip Attach to PCB (DCA) Dispensing & Underfill Epoxy Fluxes Facility Layout Halogen and Halogen-Free Head on Pillow Defect/Warpage Induced Solder Joint Defects High Melting Point Solder Laser Soldering Leadless Area Array Packages Lead-Free Soldering/Reliability Low Temperature Processing Low Volume/Prototype Non-Wet Open (NWO) Defects Package-on-Package Assembly Part Obsolescence Placement Printing Reflow Soldering/ Wave Soldering Rework and Repair of QFNs (01005, Leadless Components, PoP) Rework Reliability Robotic Soldering Selective Soldering Solder Jetting Solder Paste/Solder Voids in Joints Solderless Interconnections Supplier Engineering Thermo Compression Bonding Underfill/ Corner Glue/ Other Polymeric Reinforcements Vapor Phase Reflow Yield Improvement

Business/Supply Chain:
Capacity Modeling Conict Minerals Contract Manufacturing Counterfeit Parts Doing Business in Overseas Environmental Issues Lean Manufacturing Onshoring Operations Management Part Obsolescence RoHS/REACH Compliance Supplier Management Technology Roadmaps

Emerging Technologies:
<= 0.3mm Pitch Area Array Technologies 3D Circuits 3D Printing & Design Rules Advanced Packaging Assembly to Flex Substrates Assembly to Glass Substrates Cavity Assembly Consumer Applications Embedded Active Technology Embedded Passive Technology Flexible Electronics High Frequency Jetting of Solder Pastes LED Technology/Assembly/Reliability MEMS/RF/MOEMS Microsystems Packaging / Modular Microsystems Nanomaterials Nanotechnology, Materials, & Electronics New Materials and Processes Optoelectronics Plastic 3D PCB to PCB Technology Power or Thermal Management Power Electronics Printed Electronics Technology Reliability of Nanodevices Resin Reinforcement Solder Pastes Sensors and Manufacturing Smart Manufacturing Systems Small Die Size Singulation Solid State Lighting Solar Technology System in a Package Thermal Interface Materials Touch Screen Technologies Virtual Prototyping Wearable Electronics Wireless Applications

Harsh Environment Applications
(Military, Aerospace, Automotive, Industrial, Oil & Gas):
Alternate Energy Battery Prognostics Components and Reliability Copper Corrosion COTS High Lead Solder Replacement High Temperature Electronics Lead-free Issues Non-Destructive Inspection Micro-Computed Tomography Multiphysics Modeling Substrates and Finishes Thermal Management Tin Whiskers

PCB Technology:
Bio-Compatible Substrates Black Pad and Surface Finish Defects Conductive Anodic Filament (CAF) Creep Corrosion Embedded Passive/Active Components Halogen Free HDI High Power PCBs Micro-vias (including filled/unfilled) Moisture Sensitivity New Laminate Materials New Surface Finishes & Solderability Pad Cratering Soldermask Substrate Reliability

Process Control:
Acoustic Imaging (C-SAM) Bene-ts of AOI & SPI CIM In-Circuit Test Process Modeling Software Test Strategies 2D/3D X-Ray

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