26th Microptics Conference
Abstr. due: 23.04.2021
Dates: 26.09.21 — 29.09.21
Area Of Sciences: Physics and math;
Organizing comittee e-mail: firstname.lastname@example.org
Organizers: The Japan Society of Applied Physics, Organized by Microoptics Group, JSAP
The category of the conference covers the following subjects of microoptics;
1)Theory, Modeling, and Design
Aberrations, Dispersion, Beam optics, Guided-wave optics, Gradient-index optics, Diffractive optics, Photonic band, Slow light, Near-field optics, Nonlinear optics, Thermooptics, Plasmonics, Metal optics, Quantum optics/photonics, Biomimetic optics, Metaoptics, Simulation and system design, etc.
2)Materials and Fabrication
Semiconductors, Crystals, Dielectric materials, Polymers, Liquid crystals, Nonlinear materials, Composite materials, Nano-materials, Transparent conductors, Magneto-optic materials, Spin-materials, Metamaterials, Nanocarbons, etc. Micro- and nano-fabrication, Nano-imprint, Laser processing, Heterogeneous bonding, 3D printing, Optical manipulation, etc.
3)Measurement and Sensing
Spectroscopy, Interferometry, Reflectometry, Ultrafast measurement, 3D measurement, Quantum measurement, LiDAR, etc.
4)EO/OE and Active Devices
Lasers, LEDs, VCSELs, Array lasers, Amplifiers, Photo detectors, Terahertz devices, Optical imaging sensors, Solar cells, Energy harvesting devices, etc.
Fibers, Waveguides, Multi/demultiplexers, Add-drop multiplexers, Branching and mixing components, Photonic crystals, Filters, Microlenses, Diffractive optical elements, Isolators, Polarizers, etc.
6)Dynamic and Functional Devices
MEMS, Switches, Modulators, Tunable devices, Wavelength converters, Nonlinear optical devices, Deflectors, Optical buffers, etc.
7)Integration, Packaging, and Si photonics
Monolithic and hybrid integration, Mounting and packaging, Micro-assembly, Wafer-level assembly, 3D integration, etc.
8)System and Design Conception
Conference Web-Site: https://moc2021.com/general-info.php