20th European Microelectronics Packaging Conference & Exhibition

Страна: Германия

Город: Friedrichshafen

Тезисы до: 15.01.2015

Даты: 14.09.15 — 16.09.15

Область наук: Экология; Технические;

Е-мейл Оргкомитета: empc@mcc-pr.de.

Организаторы: IMAPS Germany


We kindly invite you to join the 20th European Microelectronics and Packaging Conference & Exhibition at the Graf-Zeppelin-Haus in Friedrichshafen at Lake Constance.

For more than 40 years IMAPS is the leading Microelectronics Packaging, Interconnect and Assembly society, facilitating means of communication, education and interaction at all levels. IMAPS is dedicated to the advancement and growth of the community, with focus on developments in packaging technologies of the present and future (3D Integration, SMT-, CoB- and FC-Assembly, Embedding, Wafer Level Packaging, Encapsulation, Printed Electronics, MEMS, Photonics, HF-, HT- and Power-Electronics, Advanced Materials, Thermal Management, Modeling/Design/Simulatiuon, Reliability amongst others).

At the EMPC 2015, we will provide you with excellent presentations (and posters) of most recent research and development results worldwide. Bringing together the entire microelectronics supply chain, technical and marketing professionals. The variety of sessions offer the possibility to enhance professional development, technical knowledge/skills and enables career progression. Furthermore, the industrial exhibition will highlight the latest products and service applications of the current technology. We look forward to welcoming you to an inspiring and stimulating event.

Get connected with the members of the IMAPS community: driving forces of progress to improve daily life, who have made significant contributions to the world we live in, such as communication, health, mobility and energy consumption.

Friedrichshafen, famous as the birth place of the zeppelin airships, provides an appealing mixture of high-technology, tradition as well as international atmosphere as a holiday resort. The unique landscape at the border triangle of Germany, Austria and Switzerland elevates the town to one of the most interesting congress locations throughout Germany.

The conference is an important platform for the dialogue between industry (manufacturers) and academia (researchers). Don’t miss the opportunity to meet international experts and exchange experience, ideas and cutting edge information of microelectronics and packaging industries at the EMPC 2015.

Веб-сайт конференции: http://www.empc2015.org/