Laboratory ultrasonic and thermal weldingPublished by emelezhik on Ср, 09/21/2016 - 15:44
Ultrasonic welding is an industrial technique where high-frequency ultrasonic acoustic vibrations are locally applied to workpieces being held together under pressure to create a solid-state weld. It is commonly used for plastics, and especially for joining dissimilar materials. In ultrasonic welding, there are no connective bolts, nails, soldering materials, or adhesives necessary to bind the materials together.
The applications of ultrasonic welding are extensive and are found in many industries including electrical and computer, automotive and aerospace, medical, and packaging. Whether two items can be ultrasonically welded is determined by their thickness. If they are too thick this process will not join them. This is the main obstacle in the welding of metals. However, wires, microcircuit connections, sheet metal, foils, ribbons and meshes are often joined using ultrasonic welding.
Ultrasonic welding is a very popular technique for bonding thermoplastics. It is fast and easily automated with weld times often below one second and there is no ventilation system required to remove heat or exhaust. This type of welding is often used to build assemblies that are too small, too complex, or too delicate for more common welding techniques.
Welding equipment - Model 626 Deep Access, Long Reach Wire Bonder that can operate as a Ball, Wedge, Bump or Peg bonder. The 626 can be used for wire diameters from 0.7 to 2.0 mil (18 to 51 µm) gold wire when in ball bonder configuration or 0.5 to 3.0 mil (12 to 76 µm)and ribbon up to 1.0 x 12.0 mil (25 x 300 µm) when in wedge or Peg bonding mode. The 626 was specifically designed for applications that require bonding at extreme height differences between 1st and 2nd bonds and for bonding wires to sensitive devices such as gallium arsenide FET's and LED's.
Model 626's motorized wire feed and wire/ribbon clamping system provides superior wire/ribbon control and allows the operator to increase or decrease tail length in 1 mil (25 µm) increments at a touch of a switch. 626 shows actual units for set up of bond parameters. Change over from Ball bonder to Wedge bonder requires only a press of a button to turn EFO power to zero and a change from capillary to wedge tool. 626 can also operate in Bump or Peg bonding modes. Add OP-47 for pick, place and bond feature.The system allows heating boiled soft to 250 °C at intervals of 0.1 °C.
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