IMAPS International Conference and Exhibition on High Temperature Electronics Network (HiTEN 2019)

Страна: Великобритания

Город: Oxford

Тезисы до: 31.01.2019

Даты: 08.07.19 — 10.07.19

Е-мейл Оргкомитета: colin.johnston@materials.ox.ac.uk

Организаторы: St. Anne’s College in the University of Oxford

 

The objective of the HiTEN Conference is to have a unique forum that brings together researchers and practitioners in academia and industry from all over the world. All styles of practical high temperature electronics design and implementation approaches are encouraged, along with a variety of high temperature application areas. Today the main semiconductor focus of HITEN is silicon and silicon on insulator (SOI).  Although, HITEN is not simply a semiconductor focused network. HITEN provides a conduit for the exchange and dissemination of information on all aspects of high temperature electronics. It is a global network with users, suppliers, developers and fundamental researchers dealing in all aspects of High Temperature Electronics.

Abstracts are being requested in the following areas:

  • Applications in the Aerospace, Automotive, Oil & Gas, and Geothermal Industries
  • Devices and applications
  • Novel devices
  • ASICs for high temperature applications
  • Memories
  • Passive components
  • Power devices
  • Semiconductor materials
  • Contacts and metallizations
  • Materials
  • Packaging and inter connects
  • Sealants, adhesives, solders
  • Reliability and failure mechanisms
  • Lifetime predictions
  • Accelerated life testing
  • Testing at high temperatures

Веб-сайт конференции: http://www.imaps.org/hiten/

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