16th International Conference and Exhibition on Device Packaging

Страна: США

Город: Fountain Hills

Тезисы до: 11.10.2019

Даты: 02.03.20 — 05.03.20

Область наук: Технические;

Е-мейл Оргкомитета: bschieman@imaps.org

Организаторы: IMAPS - International Microelectronics Assembly and Packaging


The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.

Веб-сайт конференции: http://www.imaps.org/DevicePackaging/index.htm

Конференции по теме - с близкими дедлайнами: