IEEE Symposium on VLSI Circuits

Країна: Японія

Місто: Kyoto

Тези до: 26.01.2015

Дати: 15.06.15 — 19.06.15

Область наук: Технічні;

Е-мейл Оргкомітету: vlsi@vlsisymposium.org

Організатори: IEEE

 

Symposium scope includes new concepts and breakthroughs in VLSI technology devices and processes including:
1. Memory, Logic, RF, Analog, Mixed-Signal, I/O, High-Voltage, Imaging, MEMS, integrated sensors, and SOC (system-on-chip)
2. Advanced gate stacks, channels, junctions and contacts
3. Heterogeneous integration of non-Si materials/substrates on Si substrates
4. Advanced lithography and high-density VLSI patterning technologies
5. Beyond-CMOS functional devices with a path for VLSI implementation
6. Interconnect scaling and Cu alternatives; chip-to-chip including optical interconnects
7. Packaging technologies, through-silicon-vias (TSVs) and 3D-system integration
8. Advanced materials, device analysis, and modeling
9. Theoretical understanding, operation fundamentals and reliability issues related to the above devices
10. VLSI manufacturing concepts, technologies and yield optimization

 

The scope of the Symposium on VLSI Circuits includes innovations and advances in the following areas:
• Digital circuits and processor techniques, including those for standalone and embedded processors
• Memory circuits, architectures, and interfaces for volatile and non-volatile memories, including emerging memories
• Clock generation and distribution for high-frequency digital and mixed-signal applications
• Analog and mixed-signal circuits, including amplifiers, filters, and data converters
• Wireline receivers and transmitters, including circuits for inter-chip and long-reach applications
• Wireless receivers and transmitters, including circuits for WAN, LAN, PAN, BAN, and inter-chip applications
• Power management circuits, including those for battery management, voltage regulation, and energy harvesting
• Application-oriented VLSI systems, imagers, displays, sensors, and biomedical and healthcare applications

Веб-сторінка конференції: http://www.vlsisymposium.org/index.html

Конференції по темі - із близькими дедлайнами:

2019 2nd International Conference on Virtual Reality Technology (ICVRT 2019)Тези приймаються до 20.07.19, Wuhan

International Conference on Heat Transfer and Thermal Engineering (HTTE 2019)Тези приймаються до 20.07.19, Xi’an