20th Microoptics Conference

Країна: Японія

Місто: Fukuoka

Тези до: 01.06.2015

Дати: 25.10.15 — 28.10.15

Область наук: Фізико-математичні;

Е-мейл Оргкомітету: ogura@comemoc.com

Організатори: Microoptics Group


OBJECTIVE The 20th MICROOPTICS CONFERENCE (MOC '15) will be held at FUKUOKA INTERNATIONAL CONGRESS CENTER, Fukuoka, Japan on October 25 - October 28, 2015. This conference is sponsored by the Japan Society of Applied Physics (JSAP) and organized by Microoptics Group, JSAP and in cooperation with several academic societies and associations.
The MOC '15 is intended to provide a central forum for an update and review of scientific and technical information covering a wide range of microoptics field from fundamental researches to systems and applications. CATEGORY The category of the conference covers the following subjects of microoptics;

1. Theory, Modeling, and Design

Aberrations, Dispersion, Beam optics, Guided-wave optics, Gradient-index optics, Diffractive optics, Photonic band, Slow light, Near-field optics, Nonlinear optics, Thermooptics, Plasmonics, Metal optics, Quantum optics/photonics, Biomimetic optics, Simulation and system design, etc.

2. Materials and Fabrication

Semiconductors, Crystals, Dielectric materials, Polymers, Liquid crystals, Nonlinear materials, Composite materials, Nano-materials, Transparent conductors, Magneto-optic materials, Spin-materials, Metamaterials, Nanocarbons, etc.
Micro- and nano-fabrication, Nano-imprint, Laser processing, Heterogeneous bonding, 3D printing, etc.

3. Measurement and Sensing

Spectroscopy, Interferometry, Reflectometry, Ultrafast measurement, 3D measurement, Quantum measurement, etc.

4. Passive Devices

Fibers, Waveguides, Multi/Demultiplexers, Add-drop multiplexers, Branching and mixing components, Photonic crystals, Filters, Microlenses, Diffractive optical elements, Isolators, Polarizers, etc.

5. Dynamic and Functional Devices

MEMS, Switches, Modulators, Tunable devices, Wavelength converters, Nonlinear optical devices, Deflectors, Optical buffers, etc.

6. EO/OE and Active Devices

Lasers, LEDs, VCSELs, Array lasers, Amplifiers, Photo detectors, Terahertz devices, Optical imaging sensors, Solar cells, Energy harvesting devices, etc.

7. Integration, Packaging, and Si photonics

Monolithic and hybrid integration, Mounting and packaging, Micro-assembly, Wafer-level assembly, 3D integration, etc.

8. System and Design Conception


Веб-сторінка конференції: http://www.moc2015.com/

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