International Conference on Smart Materials Analysis (ICSMA 2018)
Країна: Сингапур
Місто: Singapore
Тези до: 25.09.2017
Дати: 26.01.18 — 28.01.18
Область наук: Технічні;
Е-мейл Оргкомітету: icsma@saise.org
Організатори: SAISE
This is 2018 International Conference on Smart Materials Analysis (ICSMA 2018) conference committee. We are very pleased to tell you that ICSMA 2018 will be held in Singapore during January 26-28, 2018.
ICSMA provides a forum for accessing to the most up-to-date and authoritative knowledge from both industrial and academic worlds, sharing best practice in the field of smart materials Analysis. The meeting will provide an opportunity to highlight recent developments and to identify emerging and future areas of growth in this exciting field.
Веб-сторінка конференції: http://www.icsma.org/index.html
Конференції по темі - із близькими дедлайнами:
Европейское научное обозрение. Выпуск №11-12/2019Тези приймаються до 30.12.19, Вена