The 20th International Conference on Electronic Materials and Packaging

Країна: Гонконг

Місто: Hong Kong

Тези до: 31.08.2018

Дати: 17.12.18 — 20.12.18

Е-мейл Оргкомітету: emap2018@ust.hk.

Організатори: Hong Kong University of Science and Technology

 

The 20th International Conference on Electronics Materials and Packaging (EMAP 2018) will be held in Hong Kong, a gateway in between the East and West. The purpose of the conference is to promote awareness of new advances in materials, design and simulations, fabrication, reliability, and thermal management of microsystem/MEMS packages. The EMAP 2018 Committee is now inviting researchers, engineers, scientists and professors and students to submit an abstract and join EMAP 2018. The accepted papers will be submitted for inclusion into IEEE Xplore® Digital Library.
From the successful stories of previous EMAP conferences held in Japan, Korea, Malaysia, Singapore, and Taiwan, this annual event offers a great opportunity to unite people from academia, research institutions and industries to share their innovative thoughts, state-of-the-art technologies and recent developments. The program includes invited and keynote presentation from world-renowned speakers, interactive sharing sessions and technical short courses. Excursion will be arranged after the technical sessions to show you the natural side of Hong Kong. Come and join us. See you in EMAP 2018.

Topics:

• Additive Manufacturing

• Advanced Packaging Technologies

• Emerging Technologies

• Design, Modeling and Simulation

• High Density and 3D Packaging

• Interconnections

• Materials and Processing


• Microsystems Packaging and Applications

• Optoelectronics and Photonics

• Power Electronics Integration

• Quality and Reliability Assessment

• System Integration

• Thermal Management

 

Веб-сторінка конференції: http://emap2018.ust.hk/

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