Workshop on Advances in Packaging and Components

Країна: Нідерланди

Місто: Noordwijk

Тези до: 10.10.2018

Дати: 14.03.19 — 15.03.19

Область наук: Технічні;

Е-мейл Оргкомітету: esaconferencebureau@atpi.com

Організатори: IEEE

 

Packaging of EEE parts used in spacecraft is a crucial aspect of ensuring the performance, reliability and lifetime of components. Therefore, it represent a major concern for space applications. In recent years, the development and deployment of EEE Components has been driven by higher thermal and electrical performance, higher functionality and complexity, introduction of new materials and lower costs and lead time reductions. 

Recent developments in the space market place are driving the proposal and use of COTS (Components Off The Shelf) which represents a significant change in the space industry, and challenges the traditional approach to EEE parts procurement and qualification. Discussion and consideration of this topic will be a significant entity during the proceedings.

Advances Packaging and Components (APaC) is a significant opportunity for discovering & learning about the latest advances and developments in the components and packaging field, and to meet & discuss topics with recognized experts from industry, academia and agencies.

The workshop consists of both invited and submitted papers and presentations covering the following topics:
• Application, Trends and Needs
• New Technologies and Materials for components packaging
• COTS Usage, Evaluation & Qualification
• New Developments in inspection and validation methods 
• Lessons Learned and In-flight Experiences
 

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