28th Conference on Electrical Performance of Electronic Packaging

Країна: Канада

Місто: Montreal

Тези до: 15.07.2019

Дати: 06.10.19 — 09.10.19

Область наук: Технічні;

Е-мейл Оргкомітету: roni.khazaka@mcgill.ca

Організатори: EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society

 

EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis, synthesis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and CAD/design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society. Authors are invited to submit papers describing new technical contributions related to the broad area of electrical performance of high-performance interconnect systems, covering:

  1. Emerging and advanced issues,
  2. New design techniques and innovative architectures
  3. Novel CAD concepts, methodologies and algorithms for modeling, simulation and optimization,

with emphasis on:

  • System-level, board-level, package-level and on-chip interconnects
  • High-speed channels, links, backplanes, serial and parallel interconnects, SerDes
  • RF/microwave/mm-wave packaging structures and components, antenna-in-package and RFIC co-design, mixed signal modules and wireless switches
  • Signal and thermal integrity
  • Power integrity and power distribution networks
  • Low power mobile and personal applications
  • Memory and DDR interfaces
  • Jitter and noise management
  • Electronic packages and microsystems
  • Heterogeneous integration, 2.5D/3D interconnects and packages, TSVs and MCMs
  • Electromagnetic (EM) and EM interference modeling, simulation algorithms, tools, and flows
  • Macromodeling and model order reduction as it applies to electrical analysis
  • Advanced and parallel CAD techniques for signal, power, and thermal integrity analysis
  • Measurement and data analysis techniques for system‐level and on‐chip structures.

Веб-сторінка конференції: http://www.epeps.org/papers.html

Конференції по темі - із близькими дедлайнами: