ITherm 2020 - The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

Країна: США

Місто: Lake Buena Vista

Тези до: 02.09.2019

Дати: 26.05.20 — 29.05.20

Область наук: Фізико-математичні;

Розкажіть колегам:

Е-мейл Оргкомітету: listserv@listserv.ieee.org

Організатори: IEEE

 

Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2020 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.

All papers will be peer reviewed and published in the ITherm proceedings. Student first authors will have the opportunity to apply for ITherm travel grants in order to make an oral presentation and participate in a Student Poster and Networking Session.

Веб-сторінка конференції: https://www.ieee-itherm.net/itherm/conference/home

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