5th International Conference on Integrated Circuits and Microsystems (ICICM 2020)

Країна: Китай

Місто: Nanjing

Тези до: 05.05.2020

Дати: 23.10.20 — 25.10.20

Область наук: Технічні;

Е-мейл Оргкомітету: icicm@young.ac.cn

Організатори: ICICM 2020

 

IEEE--2020 The 5th International Conference on Integrated Circuits and Microsystems (ICICM 2020)--Ei Compendex, Scopus, and CPCI

Time: October 23-25, 2020

Place: Nanjing, China

http://www.icicm.net/

 

==Publication: All accepted papers after proper presentation and registration will be collected in the IEEE conference proceedings, which will be submitted and reviewed in the IEEE Xplore, Ei Compendex, Scopus, and CPCI (Web of Science) after the conference.

==Submission email:icicmyoung.ac.cn (Or you still can submit to the submission system on website)

==Find the tempalte with the link: http://icicm.net/Template.doc (Word) http://icicm.net/WIN-or-MAC-LaTeX2e-Tran... (Latex)

 

★Keynote Speakers

Prof. Ljiljana Trajkovic, IEEE Fellow,Simon Fraser University, Canada

Prof. Fei Yuan,Ryerson University, Canada

 

★Invited Speakers

Prof. Sheng-Lyang Jang,National Taiwan University of Science and Technology, Taiwan

Prof. Dai Yong-Sheng,Nanjing University of science & Technology, China

 

★ICICM Committees

Advisory Chair

Prof. Ljiljana Trajkovic, IEEE Fellow, Simon Fraser University, Canada

 

Conference Chairs

Prof. Zhigong Wang, Southeast University, China

Prof. Li Qiang, University of Electronic Science and Technology of China, China

Prof. Gene Eu Jan, National Taipei University, Taiwan

 

Program Chairs

Prof. Fei Yuan, Ryerson University, Canada

Prof. Zou Zhuo, Fudan University, China

Prof. Liu Dake, Beijing Institute of Technology, China | Link?ping University, Sweden

Assoc. Prof. Keping Wang, Southeast University, China

 

Steering Committee Chairs

Prof. Huang Le Tian, University of Electronic Science and Technology of China, China

Prof. Dai Yong-Sheng, Nanjing University of Science & Technology, China

Prof. Sheng-Lyang Jang, National Taiwan University of Science and Technology, Taiwan

 

Technical Committee

Prof. Xiaoxiao Wang, BeiHang University, China

Prof. Bo Yan, University of Electronic Science & Technology of China, China

Prof. Dr. Ashutosh Kumar Singh, National Institute of Technology, Kurukshetra, India

Assis. Prof. Hossein Fariborzi, King Abdullah University of Science and Technology, Saudi Arabia

Assoc. Prof. Hamed Alipour-Banaei, Islamic Azad University, Iran

Assoc. Prof. Tiejun Chen, Yiyang Medical College, China

Assis. Prof. Weiguang Sheng, Shanghai Jiao Tong University, China

Prof. Changchun Zhang, Shanghai University of Posts and Telecommunication / Southeast University, China

Assis. Prof. Yu Bai, California State University Fullerton, USA

Prof. Jinzhao Wu, Guangxi University for Nationalities, China

Prof. Shiwei Feng, Beijing University of Technology, China

Assoc. Prof. Wei Ni, Hefei University of Technology, China

Prof. Xingyuan Tong, Xi'an University of Posts & Telecommunications,China

Prof. Jinyan Wang, Peking University, China

Prof. Zhi-Jian Xie, NC A&T State University, USA

Prof. S. Ushakumari, College of Engineering Trivandrum, India

Prof. Lu Tang, Southeast University, China

Prof. Haizhi Song, University of Electronic Science and Technology of China, China

Prof. Tang Bin, Chengdu Aeronautic Polytechnic, The Innovation Base of School-Enterprise Cooperation Aviation Electronic Technology in Sichuan, China

Prof. Shiwei Feng, Beijing University of Technology,China

Assoc.Prof. Quanzhen Duan,Tianjin University of Technology, China

Assoc.Prof. Yue Ming Ding,Tianjin University of Technology,China

Prof.Shengming Huang,Tianjin University of Technology, China

Prof. Fei Yuan, Ryerson University, Canada

Assoc. Prof. Guolin Sun, Beihang University, China

Assoc. Prof. Yuan-Hao Huang, National Tsing Hua University,Taiwan

Asst. Prof. Dr. Najam Muhammad Amin, Bahria University, Pakistan

Prof. Dr.Qifeng Xu, Fuzhou University, China

 

For more members, please visit conference website: http://www.icicm.net/committee.html

 

★History

 

Papers of ICICM2019 can be checked in IEEE Xplore!

Electronic ISBN: 978-1-7281-5132-8 | USB ISBN: 978-1-7281-5131-1

 

Papers of ICICM2018 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!

Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5

 

Papers of ICICM2017 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!

Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0

 

Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!

Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3

 

★Topics

Digital, Analog, Mixed Signal IC and SOC design technology

Silicon integrated circuits and manufacturing

Low-power, RF devices & circuits

IC Computer-Aided –Design technology, DFM

Silicon/germanium devices and device physics

Interconnect, Low K, High K and other process technologies

Unconventional and nano-electronics

Organic semiconductor devices and technologies

Compound semiconductor devices and circuits

Displays, sensors and MEMS

Semiconductor materials and material characterization

Packaging and testing technology

Solar cell & other devices for new energy sources

Modeling and simulation

Equipment technology

Reliability

Displays, sensors and MEMS

Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)

 

★Support

1, Technical Support from IEEE

2, Sponsored by University of Electronic Science and Technology of China and Southeast University, China

 

★Conference Schedule

1) October 23, 2020—Registration & Material Collecting

2) October 24, 2020—Keynote & Invited Speeches & Papers Presentations

3) October 25, 2020—Papers Presentations

 

★Conference Contact

Ms Daisy Tseng

Email: icicmyoung.ac.cn

Tel: +86-28-87777577

Веб-сторінка конференції: http://www.icicm.net/

Конференції по темі - із близькими дедлайнами:

Европейское научное обозрение. Выпуск №5-6/2020Тези приймаються до 30.06.20, Вена