26th Microptics Conference

Країна: Японія

Місто: Shizuoka

Тези до: 23.04.2021

Дати: 26.09.21 — 29.09.21

Область наук: Фізико-математичні;

Е-мейл Оргкомітету: moc2021@or.knt.co.jp

Організатори: The Japan Society of Applied Physics, Organized by Microoptics Group, JSAP

 

The category of the conference covers the following subjects of microoptics;

1)Theory, Modeling, and Design

Aberrations, Dispersion, Beam optics, Guided-wave optics, Gradient-index optics, Diffractive optics, Photonic band, Slow light, Near-field optics, Nonlinear optics, Thermooptics, Plasmonics, Metal optics, Quantum optics/photonics, Biomimetic optics, Metaoptics, Simulation and system design, etc.

2)Materials and Fabrication

Semiconductors, Crystals, Dielectric materials, Polymers, Liquid crystals, Nonlinear materials, Composite materials, Nano-materials, Transparent conductors, Magneto-optic materials, Spin-materials, Metamaterials, Nanocarbons, etc. Micro- and nano-fabrication, Nano-imprint, Laser processing, Heterogeneous bonding, 3D printing, Optical manipulation, etc.

3)Measurement and Sensing

Spectroscopy, Interferometry, Reflectometry, Ultrafast measurement, 3D measurement, Quantum measurement, LiDAR, etc.

4)EO/OE and Active Devices

Lasers, LEDs, VCSELs, Array lasers, Amplifiers, Photo detectors, Terahertz devices, Optical imaging sensors, Solar cells, Energy harvesting devices, etc.

5)Passive Devices

Fibers, Waveguides, Multi/demultiplexers, Add-drop multiplexers, Branching and mixing components, Photonic crystals, Filters, Microlenses, Diffractive optical elements, Isolators, Polarizers, etc.

6)Dynamic and Functional Devices

MEMS, Switches, Modulators, Tunable devices, Wavelength converters, Nonlinear optical devices, Deflectors, Optical buffers, etc.

7)Integration, Packaging, and Si photonics

Monolithic and hybrid integration, Mounting and packaging, Micro-assembly, Wafer-level assembly, 3D integration, etc.

8)System and Design Conception

Веб-сторінка конференції: https://moc2021.com/general-info.php